OKMX8MP-C Single Board Computer Based on NXP i.MX8M Series
OKMX8MP-C single board computer(SBC) is powered by the high-performance processor, NXP i.MX 8M Plus with built-in NPU and ISP. With an AI computing capacity up to 2.3TOPS, it can meet most compact Edge AI Solution. The flexible I/O interfaces are convenient for users' application development. The SBC supports 2 Gigabit Ethernet, 2 CAN-FD, 4 UART, 4G, 5G, dual-band WiFi, PCIe3.0, USB3.0, HDMI2.0, LVDS, MIPI_CSI, MIPI_DSI and other interfaces. Featuring industrial-grade design with ESD and EMI solutions, OKMX8MP-C is widely used in various fields, such as smart cities, Industry 4.0, smart medical devices, intelligent transportation and other applications.
Key Features of i.MX8M Plus Single Board Computer:
- A Neural Processing Unit (NPU) operating at up to 2.3 TOPS;
- Dual Image Signal Processor (ISPs): Resolution up to 12MP and input rate up to 375MPixels/s;
- Powerful quad Arm® Cortex®-A53 processor plus real-time control with Cortex-M7, up to 800MHz;
- Robust control networks supported by dual CAN FD and dual Gigabit Ethernet with Time Sensitive Networking (TSN);
- Dual 8LVDS display.
Advantages of OKMX8MP-C Single Board Computer:
- UBOOT adds MIPI and LVDS display drivers;
- Increase UBOOT LOGO Keep function;
- Increase UBOOT's use of the kernel device tree to configure hardware functions;
- Adapt to the WIFI module, and solve a series of bugs in the module;
- Fix a series of problems in the three-screen display and HDMI startup and plug-in process.
Features of i.MX8M Plus System on Module (SoM):
- EEPROM chip is reserved on the SoM to ensure hardware consistency;
- The SoM adopts LPDDR4, up to 8MP, 4GT/S;
- Some high-speed signal circuits of LPDDR4 have passed the simulation test, and the stability is guaranteed;
- The bottom structure considers the shell and industry design, which is convenient for productization;
- The communication interface considers EMC protection requirements, and adds static electricity and isolation design.
OKMX8MP-C SBC
High-speed Communication Interface
4K Picture Quality and HiFi Voice Experience
The HDMI interface enables up to 4K display output. Additionally, it is equipped with LVDS and MIPI-DSI display interfaces.
It can support three display interfaces, including three screens with the same display or three screens with different displays.
It incorporates the latest audio technology, such as Cadence® Tensilica® HiFi 4 DSP @ 800 MHz, 6x I2S TDM, DSD512, S/PDIF Tx + Rx, 8-channel PDM microphone input, eARC, and ASRC.
Advanced Multimedia Technology
3D/2D Graphics Acceleration
Machine Learning and Vision
Built-in NPU, AI computing capability 2.3TOPS, meeting the needs of lightweight edge computing
Built-in Image Signal Processor (ISP)
Industrial Grade Quality
Industrial grade temperature range test -40℃~+85℃ (except WiFi module). Communication interface Static electricity protection level 4 and 1.5KV Isolation protection
Rich Communication Interface
Flexible Optional Wireless Module
Support dual-band WiFi, 4G module, 5G module with SDIO3.0 interface
Interface Resources
▊ iMX8M Plus SoM/SBC Video
OKMX8MP-C Single Board Computer Demo | iMX8M Plus NXP based
▊ Hardware Features
iMX8M Plus System On Module Basic Parameters |
||
|---|---|---|
| Product Name | FETMX8MPQ-C | FETMX8MPL-C |
| CPU | NXP i.MX8M Plus Quad | NXP i.MX8M Plus QuadLite |
| Architecture | Quad-Core Cortex-A53, Single-Core Cortex-M7 | Quad-Core Cortex-A53, Single-Core Cortex-M7 |
| Frequency | 1.6GHz + 800MHz | 1.6GHz + 800MHz |
| RAM | 1/2/4GB LPDDR4 | 1/2GB LPDDR4 |
| ROM | 8GB / 16GB eMMC | 8GB / 16GB eMMC |
| GPU |
GC7000UL（3D） GC520L（2D） OpenGL、OpenCL、Vulkan |
GC7000UL（3D） GC520L（2D） OpenGL、OpenCL、Vulkan |
| NPU | 2.3 TOPS | —— |
| Video Hardware Decoding |
Resolution: 1080p60 Formats: VP8, VP9, H.264, H.265 |
—— |
| Video Hardware Encoding |
Resolution: 1080p60 Format: H.264, H.265 |
—— |
| OS Support | Linux5.4.70 | Linux5.4.70 |
| Android11 | —— | |
| Working Voltage | 5V | 5V |
| Interface Mode | Ultra-thin board-to-board connector (4*80pin pitch 0.5mm) | Ultra-thin board-to-board connector (4*80pin pitch 0.5mm) |
| Working Temperature | -40℃~+85℃ | -40℃~+85℃ |
| Dimensions | 62mm × 36mm, Thickness 1.6mm, 8-layer ENIG PCB | 62mm × 36mm, Thickness 1.6mm, 8-layer ENIG PCB |
| iMX8M Plus System On Module Function Parameters | ||
|---|---|---|
| Peripheral source | QTY | Parameters |
| USB | 2 |
The CPU contains 2 USB 3.0/2.0 controllers with integrated PHY; Host mode: Support Super-speed (5Gbit/s), high-speed (480Mbit/s), full-speed (12Mbit/s), low-speed (1.5Mbit/s). Device mode: SS/HS/FS |
| PCIE | 1 | Support 1 PCI Express Gen3. |
| MIPI_CSI | 2 | Provides two 4-lane MIPI camera serial interfaces, which can work up to 1.5 Gbps. |
| MIPI_DSI | 1 |
Provides a 4-lane MIPI display serial interface, which can work up to 1.5 Gbps. • 1080 p60• WUXGA (1920x1200) at 60 Hz • 1920x1440 at 60 Hz • UWHD (2560x1080) at 60 Hz • WQHD (2560x1440) by reduced blanking mode |
| HDMI | 1 | Supports HDMI 2.0a display resolution up to 4Kp30Supports HDMI2.1 eARC |
| LVDS | 1 |
Single channel (4 lanes) supports 720p60 Dual asynchronous channels (8 data, 2clocks) support 1920x1200p60 |
| Ethernet | ≤2 | Ethernet ≤2 supports 2 RGMII interfaces, one of which supports TSN |
| SD | ≤2 | SD2, 4-bit, support 1.8/3.3V mode switching SD1, 8-bit, only support 1.8V mode |
| UART | ≤4 | The maximum baud rate supported is 4Mbps. |
| SPI | ≤3 | The maximum supported rate is 52Mbit/s, master-slave mode can be configured |
| I2C | ≤5 |
The highest rate supported in standard mode is 100Kbit/s; The highest rate supported in fast mode is 400Kbit/s. |
| CAN | ≤2 | The CAN FD protocol is used to implement the CAN communication controller, and the CAN protocol conforms to the CAN 2.0B protocol specification. (CAN FD requires CPU version support) |
| SAI | ≤6 | Synchronous Audio Interface (SAI), a full-duplex serial interface that supports frame synchronization, such as I2S, AC97, tdM, and codec/DSP interfaces. |
| SPDIF | ≤1 | A standard audio file transmission format, jointly developed by Sony and Philips. |
| PWM | ≤4 | With 16-bit counter; |
| QSPI | ≤1 | Has been occupied by the core board, connected to the 16MB Nor Flash |
| JTAG | 1 |
|
Note: *TBD is under development
Note: The parameters in the table are hardware design or CPU theoretical values.
| iMX8M Plus Development Board Function Parameter | ||
|---|---|---|
| Peripheral source | QTY | Parameter |
| USB3.0 Type-C | 1 | USB 3.0 of USB Type-C supports DFP, UFP and DRP |
| USB3.0 | 2 | USB Type A socket lead out, only used as Host |
| MIPI_CSI | 2 | CSI1: daA3840-30mc-IMX8MP-EVK, resolution 3840X2160CSI2: OV5645, the camera supports a maximum resolution of 2592X1944 |
| MIPI_DSI | 1 | The backplane leads to the 4 lane MIPI_DSI interface through the FPC socket, which is adapted to the Forlinx 7-inch MIPI screen by default, with a resolution of 1024 x 600@30fps. |
| LVDS | 1 | LVDS 1 dual asynchronous channels (8 data, 2clocks) support 1920x1200p60, all signals are led out |
| HDMI | 1 | Support HDMI 2.0a display resolution up to 4K@30fps Support HDMI2.1 eARC |
| Ethernet | 2 | Support 10/100/1000Mbps self-adaption, lead through RJ45. One of them supports TSN |
| PCIE | 1 | The backplane adopts standard PCIEx1 card interface and supports PCI Express Gen3 |
| TF Card | 1 | The development board supports one TF Card, and can support UHS-I TF cards, with a rate of up to 104MB/s. |
| 4G | 1 | Use it with 5G modules, support 4G modules using miniPCIE sockets, and use Quectel EC20 by default |
| 5G | 1 | Use it with 4G modules, support 5G modules using M.2 Key B socket, and use Quectel RM500Q by default |
| WiFi | 1 |
The default onboard AW-CM358M IEEE 802.11 a/b/g/n/ac dual-band WIFI, up to 433.3Mbps transceiver rate; Bluetooth 5, up to 3Mbps rate |
| Bluetooth | 1 | |
| Audio | 1 | The development board is adapted to the WM8960 chip, the headphone output and MIC input are integrated into a 3.5mm headphone jack, and it supports 2 channels of 1W8Ω speaker output, which are led out through the XH2.54 white terminal. |
| I2C | 3 | Used to mount audio, RTC, camera and other equipment on the backplane. |
| PWM | 2 | Used to adjust the backlight brightness of the display |
| RTC | 1 | With independent RTC chip on board, the time can be recorded by button battery after the bottom board is powered off. |
| UART | 4 | The backplane board carries USB to 4 serial ports, which are led out through socket pins for users to plug in equipment. |
| ECSPI | 1 | The development board leads to ECSPI2 through a 2 x 5 2.0mm pitch socket for users to plug in equipment. |
| CAN | 2 | Electrical isolation, support CAN-FD (requires CPU version support), and conform to CAN2.0B protocol |
| RS485 | 1 | Electrical isolation, automatic control of the sending and receiving direction. |
| KEY | 4 | Switch machine, reset button, and 2 user-defined buttons. |
| LED | 2 | User-defined LED lights, red and green. |
| DEBUG UART | 2 | Cortex-A53 and M7 debug serial port, the default baud rate is 115200 |
| JTAG | 1 | The development board leads to the JTAG signal through a 2 x 5 2.0mm pitch socket. |
Note: The parameters in the table are hardware design or CPU theoretical values.
| Product Name Description | |||
|---|---|---|---|
| FETMX8MP-C System On Module | General name of products for Forlinx external promotion | FETMX8MPQ-C System On Module | Quad-core processor, currently on sale. |
| FETMX8MPD-C System On Module | Dual-core processor, unreleased. | FETMX8MPX-C System On Module | The PCB is compatible with Quad-core and Dual-core (processors). |
| FETMX8MPL-C System On Module | i.MX8M Plus QuadLite Processor | ||
▊ Downloads
Datasheet:
FETMX8MP-C System on Module Datasheet
Product Manual:
OKMX8MP-C Single Board Computer Overview
Hardware Manual:
iMX8M Plus EVK Hardware Manual
▊ Accessories
Please click here to get more information about the supported modules and accessories.
▊ Technical Support
1. Files to be provided after buying
Hardware related: datasheet, user guide, carrier board schematic, carrier board PCB, SoM pinmux;
Firmware related: OS image, testing demo, source code, manual;
Compiling environment
2. Fast response after-sale technical support service
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▊ How To Buy
1. Order Online
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3. Payment Terms
100% T/T in advance.
▊ Shipment
1. Delivery: Goods will be shipped by express upon the receipt of the payment;
2. Lead time: Goods will be shipped out within five working days for sample orders and 6 weeks for bulk orders;
3. Shipping charge: Buyers should bear the shipping cost.
▊ Related News
▊ Other Forlinx NXP Series Products
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Frequency: 1.5GHz
RAM: 1GB LPDDR4
ROM: 8GB eMMC
System: Linux 5.15.52+Qt 6.3.2
Architecture: 4*A53+M7
Frequency: 1.6GHZ
RAM: 2GB/4GB LPDDR4
ROM: 16GB / 32GB eMMC
System: Linux 6.1.36
Architecture: Heterogeneous，4*Cortex-A53+M4
Frequency: 1.8GHz
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System: Linux4.14.78+QT5.10.1，Android9.0
Architecture: 4*A53+M7
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RAM: 2GB/4GB LPDDR4
ROM: 16GB eMMC
System: Linux5.4.70+Qt5.15, Android 11
